Manufacturing EMI/RFI shields

Hamavlet is an experienced manufacturer of EMI/RFI shielding applications, providing contract manufacturing services for prototyping, small series manufacturing, serial production and SMT packaging.

Hamavlet manufactures EMI shields, RF gaskets, lids, covers, frames and partitions for various industries, including: Electronics, aviation and aerospace, communications, defense, consumer products, etc. Hamavlet integrates precision cutting technologies together with delicate die bending to produce high quality products.

The need for EMI shielding

Electrical current passing through a circuit creates electromagnetic fields and radio waves that add noise and cause current reductions. Electromagnetic and radiofrequency interference can originate from an external source or from other components in the circuit.

Modern electronic applications involve smart and densely packed electronic circuits composed of miniature components. The proper functioning of these electronic components depends on minimizing the effects of electromagnetic interference. Beyond normal shielding requirements, the aviation and aerospace industries or military and defense industries have additional EMI/RFI shielding requirements due to their special operating conditions.

Manufacturing EMI/RFI shielding components

Hamavlet works in tandem with the product designers and provides prototyping and model manufacturing services as needed. The existence and position of apertures and slots plays an important role in the design of the shields. Theoretically, the ideal shield needs to be completely sealed; however, in practice shields include apertures for ventilation, for transmission or reception of selective frequencies, for inserting wires or connectors, for improving access to parts, etc.

Hamavlet assists the customer with the:

• Selection of the most suitable manufacturing solution according to the product specifications
• Transition process from R&D to serial production
• Manufacture of EMI/RFI shields in small series, medium series and large series
• SMT packaging of shields as required.

The general structure of a shield

EMI/RFI shields are constructed either as a single object or as a closed frame covered by a removable lid. The frame can be divided into compartments for protecting and shielding proximate components. Slots and apertures are often cut in the cover to enable heat transfer, access for wiring and connectors, etc. The frame is manufactured with or without protruding tabs for attaching the shields onto the PCB. The assembly is done by inserting and bending the legs or by soldering.

Common EMI/RFI shielding materials

Hamavlet uses a range of materials including: Nickel silver, phosphor bronze, beryllium copper, stainless steel, galvanized iron, and other conducting metals as per customer requirements. Common thicknesses (0.2 - 4.0 mm). The materials above can be tin coated.