Epoxy insulation, protection and bonding

Epoxy is a polymer comprised of two materials, resin and hardener. When the components are mixed, a molecular bond (covalent bond) is formed between them and a hard and strong compound is obtained.

The optical, electrical and physical attributes of the final product (resistance to heat, resistance to abrasion, strength, hardness, viscosity, transparency, chemical resistance, electrical insulation) are imparted during the molding process.

Encapsulation of electronic components

Epoxy encapsulation of electronic components protects and insulates them from harsh operating conditions, such as: Mechanical stress, extreme temperature swings, humidity, exposure to chemicals and dust, or electrical insulation. The epoxy can be applied in hot or cold molding methods depending on the type of material and product requirements:

• Cold molding - the liquid epoxy is injected at room temperature and hardens in a drying oven or, alternatively, solidifies at room temperature. Hamavlet uses cold epoxy molding to protect or insulate wiring contacts in electronics industry applications, for example: Protecting a PCB socket.
• Hot molding - the liquid epoxy is injected using a dedicated machine at a high temperature and hardens / solidifies at room temperature. Hamavlet uses hot epoxy molding to encapsulate RFID tags for a medical device application. The epoxy layer protects the identification tags from the heat generated during repetitive sterilization processes. Hamavlet also laser welds the encapsulated tags to surgical instruments.

Joining parts by epoxy bonding

Joining parts using an epoxy adhesive creates a strong bond between them. The bonding characteristics vary according to the needs, for example: rigid or flexible bond; opaque or transparent layer. Epoxy bonding can join dissimilar materials. Hamavlet uses epoxy to bond parts in applications that cannot be laser welded and require enhanced corrosion resistance.

R&D manufacturing support

• Meeting with the customer to clarify the product requirements and to define the manufacturing processes
• Preparing the equipment for the operation (adhesives, molding tools), and verifying compliance with standards. If necessary, Hamavlet designs and manufactures molds, lining tools and adhesive injection jigs. Hamavlet is experienced in preparing vacuum formed silicon molds, without air bubbles, which ensures excellent surface quality
• Specifying the molding stages
• Specifying supplementary processes - polishing, assembly, oiling.

Epoxy molding process

• Clean work environment, separate from other manufacturing processes, that includes - an air conditioned laboratory, a laminar flow hood, gloves, head covering, shoe covering and lab coats
• Adhesive dispenser enables control over the resin to hardener dosage, the injection pressure and the duration. The type and diameter of the needle is determined by the viscosity of the specific adhesive. The molding process is carried out in a laminar flow hood to prevent the infiltration of dust, fibers, and other external contaminants
• Hot molding or cold molding in accordance with the customer requirements and the type of material.

Supplementary services

• Rough or fine polishing using a bench polisher suited for the polishing of metallographic models
• In large series manufacturing, Hamavlet builds dedicated polishing jigs for the precision polishing of multiple items simultaneously
• Ultrasonic bath cleaning of parts containing a metal frame
• Laser welding assembly of metal framed parts, for example: Welding an encapsulated RFID tag having a stainless steel frame to a surgical instrument.

Quality control

• Visual inspection by an experienced quality control inspector performed under microscope magnification
• Functional inspections carried out according to customer requirements, for example: Transmission / reception testing of an encapsulated electronic component, or testing the electrical conduction of epoxy coated connectors.